For more than 165 years, Siemens AG (Berlin and Munich) has stood for innovative strength, a passion for technology, sustainability, responsibility and an uncompromising commitment to quality and excellence. As a globally operating technology company, we’re rigorously leveraging the advantages that our setup provides. To tap business opportunities in both ...
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Are you passionate about delivering the highest quality software that pushes the boundaries of semiconductor innovation? Siemens EDA is looking for highly motivated Software Quality Assurance Engineers to join our Central Engineering Solutions Group. In this role, you will play a key part in validating our cutting-edge Electronic Design Automation (EDA) solutions for advanced 2.5D and 3D System-in-Package (SiP) designs.
You will be responsible for defining, developing, and maintaining comprehensive QA strategies, with a strong focus on automation and advanced flow management using industry-standard Flow Manager tools. Your work will directly impact the reliability, performance, and success of critical workflows across multiple domains, including Physical Design, Design-for-Test (DFT), Package Design, Signal Integrity (SI), Power Integrity (PI), DC Drop, Thermal, and Mechanical Stress analysis.
Responsibilities:
Test Strategy & Development: Design and implement robust test plans and detailed test cases for complex 3D-IC EDA software, ensuring full coverage across all release phases—from DevBuild to Production.
Automation & Regression: Develop and maintain automated regression suites to ensure continuous software stability and quality across key 3D-IC workflows.
Flow Management: Utilize and enhance industry-standard Flow Managers to orchestrate complex QA flows, manage test environments, and automate build verification processes.
Testing & Analysis: Perform functional, performance, and regression testing on new and existing features, identifying issues with precision and depth.
Defect Resolution: Analyze test results, isolate defects, and collaborate closely with Product and R&D teams to drive timely resolution and verification.
Process Improvement: Contribute to the continuous enhancement of QA tools, processes, and methodologies, including the development of QA dashboards for transparent quality tracking and reporting.
Cross-Functional Collaboration: Partner with R&D, Product Management, and Application Engineering teams to understand requirements and ensure comprehensive test coverage.
Design Data & IP Management: Work with design data and IP within PLM systems, ensuring proper versioning, configuration management, and traceability of design components and test cases.
EDA Tool Usage: Apply and gain hands-on experience with industry-leading EDA tools such as HyperLynx, Solido, Innovator3D IC, Calibre, Multiphysics, and Simulation tools within the QA framework.
Release Readiness: Support release cycles by ensuring all quality gates are met for Alpha, Beta, and Production releases.
Qualifications:
Bachelor’s degree with 2+ years of experience, or a Master’s degree, in Computer Science, Computer/Electrical Engineering, or a related field, with a strong understanding of EDA concepts, particularly 2.5D/3D-IC design and verification.
Strong experience working in Linux environments, with proficiency in Python, C/C++, Tcl/Tk, Perl, and Bash/Shell for automation and flow development, along with hands-on experience using version control systems (Perforce/P4, Git).
Proven experience with QA methodologies, including test planning, test case development, regression testing, and working within CI/CD pipelines, supported by a solid understanding of SDLC and Agile practices.
Strong analytical, debugging, and problem-solving skills, high attention to detail, and the ability to work independently and collaboratively within global teams, with advanced English communication skills.
Familiarity with PLM principles and design data management in an EDA context, with experience using FlowTracer (Altair) or similar workflow orchestration tools considered a plus.
Hands-on experience in one or more 3D-IC domains (Physical Design, DFT, Package Design, SI/PI/DC Drop, Thermal, Mechanical Stress) is a plus, as is practical knowledge of EDA tools such as HyperLynx, Solido, Innovator3D IC, Calibre, FlowTherm, or SimLab, and exposure to IPLM or similar systems for managing design libraries and formats (GDS, LEF/DEF).